Upon receiving your purchase order, additional details are required to ensure a precise and efficient design process. You may upload these files using the form provided or share them via our secure file-sharing platform or your preferred file-sharing service.
Please provide the following:
- Schematic & Netlist Data – Schematic database in Altium or OrCAD format; a netlist in OrCAD format; or a detailed drawing (manual or CAD).
- Manufacturer’s Bill of Materials (BOM) – A comprehensive list of components for accurate sourcing and integration.
- Board Outline – Detailed dimensions and shape specifications.
- Board Construction Details – Material selection, target thickness, layer count, final plating, solder mask and silkscreen requirements, and any special testing considerations.
- Component Placement & Restrictions – Locations of fixed or critical components, along with any height or placement constraints.
- Layer Stack Requirements – Stack-up details for multilayer boards requiring impedance or EMI control (we are happy to facilitate communication with your board fabricator).
- In-Circuit Test (ICT) Requirements – Any testing criteria for design validation.
- High Current, Noise Sensitivity, & RF Considerations – Details on signals or nets with specific electrical requirements.
- Controlled Impedance & Length Matching – Identification of signals requiring impedance control, length matching, and target specifications.
- Customer-Specific Standards & Design Rules – Adherence to any unique guidelines or requirements.
Upon final approval of the design, we will provide a comprehensive set of project files in a compressed (zipped) format, which typically includes:
- Fabrication & Assembly Drawings (PDF format)
- ODB++ Gzip File
- Pick-and-Place Data
- 3D Board Data
- IPC-D-356A Test File
- Design Database Files
- RS-274X Photoplot Files
- Bill of Materials (BOM)
